NexPlanar Receives $3.5M in Venture Debt Financing
NexPlanar Corporation, a Hillsboro, Oregon-based developer of innovative chemical mechanical planarization (CMP) pads for the semiconductor device industry, has received $3.5m in venture debt financing from ATEL Ventures. The financing will be used for capacity expansion to support increased customer demand. The company is venture-backed by BlueRun Ventures, InterWest Partners, SmartForest Ventures, Fina Ventures, Intel […]