NexPlanar Receives $3.5M in Venture Debt Financing

NexPlanar Corporation, a Hillsboro, Oregon-based developer of innovative chemical mechanical planarization (CMP) pads for the semiconductor device industry, has received $3.5m in venture debt financing from ATEL Ventures.
The financing will be used for capacity expansion to support increased customer demand.
The company is venture-backed by BlueRun Ventures, InterWest Partners, SmartForest Ventures, Fina Ventures, Intel Capital and Entegris.

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