Ayar Labs, a Santa Clara, CA-based provider of a patented monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency and power efficient short reach interconnects, completed a $35M Series B financing.
The round was co-led by Downing Ventures and BlueSky Capital with participation from new investors Applied Ventures, LLC, Castor Ventures, and SGInnovate (Singapore), and existing investors Founders Fund, GLOBALFOUNDRIES, Intel Capital, Lockheed Martin Ventures, and Playground Global.
The company intends to use the funds to accelerate product development and commercialization of its in-package optical interconnect (I/O) solution, as well as grow its presence internationally.
Founded in 2015 and led by Charles Wuischpard, CEO, Ayar Labs leverages a patented approach that uses industry standard cost-effective silicon processing techniques to develop high speed, high density, low power optical based interconnect “chiplets” and lasers to replace traditional electrical based I/O.
Focused application areas are in Artificial Intelligence (AI), where compute to compute I/O bandwidth is a critical requirement; High Performance Computing (HPC), to enable dramatically new system architectures that can maintain Moore’s Law price/performance scaling; and Digital Beamforming radar applications, to enable interconnect bandwidths to handle massive increases in Radio Frequency (RF) inputs.