Telink Semiconductor Raises Venture Capital Funding from Intel Capital

Telink Semiconductor Co., Ltd., a Chinese fabless IC design company, raised venture capital funding from Intel Capital.

The amount of the deal was nto disclosed. It is known that this investment is part of a $67m total commitment the cvc firm had made in eight Chinese companies.

Founded in June 2010, Telink develops integrated low power radio-frequency and mixed signal system chips for Internet of Things (IoT) applications. Its product portfolio includes low-power 2.4Ghz RF SoCs for Bluetooth Smart, Zigbee, 6LoWPAN/Thread, Homekit and low-power high-precision analog ICs for resistive/capacitive/electromagnetic touch control, serving numerous markets including smart lighting, home automation, smart city, and other consumer electronics.
The company is based in Shanghai and in the USA.



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