InterPrice Technologies Raises $7.3M in Series A Funding

InterPrice Technologies

InterPrice Technologies, Inc., a NYC-based treasury capital markets funding platform, closed a $7.3m Series A funding.

The round was co-led by Nasdaq Ventures and DRW Venture Capital, with participation from existing investors including Bowery Capital.

The company intends to use the funds to accelerate product development, extend asset coverage, and expand its presence in the United States and internationally.

Led by Olga Chin, Founder and CEO, InterPrice Technologies is a secure platform that provides its users – corporate issuers and financial institutions – with transparency into financing costs. The solutions streamline bond, commercial paper, and loan pricing indications into dashboards across currencies and financing products. By normalizing data across all banking partners, the company’s technology enables corporate issuers to make informed financing decisions while expanding the reach of participating financing partners.

Since commercial launch in 2020, the company has on-boarded multiple Fortune 500 and global corporate issuers, such as HP Inc., McCormick & Company, and Takeda Pharmaceuticals, and over a dozen underwriters onto its platform.