Inpria Closes Financing Round

inpria-logoInpria Corporation, a Corvallis, Oregon-based provider of high-resolution photoresists, closed a new financing round of undisclosed amount.

The round was led by new investor Air Liquide Venture Capital (ALIAD) with participation from existing investors Samsung Venture Investment Corporation and Intel Capital and new investor Tokyo Ohka Kogyo (TOK).

The company will use the proceeds to complete product development and to scale-up manufacturing for its metal oxide photoresists.

Led by Andrew Grenville, CEO, Inpria makes metal oxide photoresists for EUV lithography for semiconductor manufacturers to increase performance and simplify processing.



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