Capcon Singapore Pte. Ltd., a Singapore-based advanced packaging solution provider, has secured around $50m in series B2 funding.
The company intends to use the funds to invest in manufacturing, marketing, and R&D.
Capcon provides a full range of advanced packaging processes, offering die bonders for wafer-level packaging, panel-level packaging, Flip chip, SIP, and Stack Die, etc. At the beginning of 2022, Capcon reached a 3-year supply agreement with ASE.
The company has planned 6 series of products to support advanced processes under various scenarios, namely, A series (Andromeda), L series (Leo), R series (Reticulum), M series (Monoceros), V series (Venus) and E series (Eridani).
At present, Capcon has served nearly 30 clients, including 7 out of top 10 semiconductor companies globally, and has received many re-purchases from several leading equipment companies such as ASE, SPIL, NEPES, and TFME. At the beginning of 2022, a long-term supply plan for the next three years has been confirmed with ASE.
FinSMEs
06/02/2023