Siemens is to acquire UltraSoC Technologies Ltd., a Cambridge, UK-based provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC).
The amount of the deal – due to close in the fourth quarter of Siemens’ fiscal year 2020 – was not disclosed.
Siemens plans to integrate UltraSoC’s technology into the Xcelerator portfolio as part of Mentor’s Tessent™ software product suite. The addition of UltraSoC to Siemens enables a unified data-driven infrastructure that can enhance product quality, safety and cybersecurity, and the creation of a comprehensive solution to allow semiconductor industry customers to overcome key pain points including manufacturing defects, software and hardware bugs, device early-failure and wear-out, functional safety, and malicious attacks.
The combination can benefit the entire semiconductor product lifecycle, including structural, electrical, and functional capabilities of SoCs.
Led by Rupert Baines, CEO, UltraSoC is a pioneer of embedding monitoring hardware into complex SoCs to enable “fab-to-field” analytics capabilities designed to accelerate silicon bring-up, optimize product performance, and confirm that devices are operating “as designed” for functional safety and cybersecurity purposes. The products are widely used in the automotive, high-performance computing, storage and semiconductor industries.
Tessent is a market leader in SoC design-for-test (DFT) solutions, and has established strengths in the field of automotive functional safety via its Tessent Safety Ecosystem.