Tignis, a Seattle, WA-based innovator in AI process control for semiconductor manufacturing, raised $7.2M in Series A funding.
The round was led by DN Capital with participation from Clear Ventures, Paul Maritz and Harel Kodesh.
The company intends to use the funds to expand its sales team and execute on current contracts.
Led by CEO Jon Herlocker, Tignis sells innovative software solutions that use AI and Machine Learning to enable next generation semiconductor manufacturing (physics-driven AI process control) processes, increase manufacturing yield, and decrease process downtime. The company’s products equip process and operations engineers with the tools necessary to design, test and implement AI projects, and ensure the implementation of AI process control and monitoring initiatives. Its technology is deployed in hundreds of facilities worldwide.
Launched in 2021, Tignis’ PAICe Product Suite accelerates the ability to build, validate and deploy physics-driven, machine learning-enabled solutions in semiconductor manufacturing. PAICe Monitor allows process engineers to quickly harness data using the proprietary low-code language to find and investigate problems with production, while PAICe Maker speeds up simulations, enabling semiconductor manufacturers to adaptively control complex OEM machinery in real time.
In addition to today’s funding announcement, the company has raised $7.4 million in angel and seed funding since 2017, not including a $1 million investment in 2021 from innovation company BMNT. It also completed the enterprise accelerator program H4XLabs to accelerate the growth of its first commercial product.