SJ Semiconductor Co., a Jiangyin, China-based MEOL (Middle-End-Of-Line) foundry specializing on advanced Bumping and 3D Multi-Die Integration technology, raised $300m in Series C financing.
Backers included newly joined CMBI, CICC Capital, Oriza Rivertown, Oriza Hua Capital, Walden CEL, CCB PE, CCB Trust, Growth, Country Garden Venture, HTPE, SCGC, CITIC Securities and GP Capital, etc.
The Series C funding, which brings total equity raised to $630m, enables the company to continue growing according to its business plan and strengthen its position in advanced packaging.
Founded in August 2014, SJSemi aims to offer Middle-End-Of-Line (MEOL) manufacturing and testing services and develop the advanced 3D Multi-Die Integration technology and solutions.
FinSMEs
18/03/2022