3D Glass Solutions Raises Additional $4M in Series B1 Round Extension

3D Glass Solutions

3D Glass Solutions Inc., an Albuquerque, N.M.-based innovator of glass-based three-dimensional passive radio frequency (RF) devices, has raised an additional $4m in an extended Series B1 funding round.

Backers included new investor Menlo Microsystems Inc., as well as follow-on investments from both Corning Incorporated (NYSE: GLW) and Sun Mountain Capital, bringing the total Series B1 raise to $24m.

Led by Mark Popovich, CEO and president, 3D Glass Solutions is an expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics. The company manufactures a wide variety of glass-based, system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® glass ceramic technology for applications in RF electronics and photonics used in automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT industries. 3DGS glass ceramic-based RF products can be combined with any number of designs or devices to create unique and valuable SiP products. The company has created foundational patent positions related to all photosensitive glass- ceramic materials and devices and owns the fundamental intellectual property for all four positions (materials, design, systems and manufacturing) related to glass-ceramic devices for the electronics packaging industry.

The initial use of the technology will be for supply of components to Menlo Microsystems for its Ideal Switch™, under a long-term supply agreement between 3DGS and Menlo Microsystems.

FinSMEs

31/01/2022