Holo Raises Undisclosed Series B Funding


Holo, a Newark, CA-based metal additive manufacturing company, raised an undisclosed amount in Series B funding.

The round was led by Lam Capital, Lam Research’s venture group, and Atreides Management, with participation from Prelude Ventures, Tao Capital Partners and Lightspeed Venture Partners.

The company intends to use the funds to double its team to expand throughput of tools and add new materials.

Led by Hal Zarem, CEO, Holo leverages the Pureform™ platform of proprietary hardware, materials and software, which produces high resolution geometries that can be powderized and sintered, including pure copper, stainless steels and other metal alloys. Spun out of Autodesk in 2017 by the team who developed and led Autodesk’s Ember additive manufacturing product, the company serves customers across industries spanning semiconductor, high performance compute, consumer electronics, automotive, aerospace and medical.

With the closing of its latest financing round, Holo plans to accelerate development of its 3,000 cm3/hr high throughput production system and continue to expand its materials portfolio.