Inpria Raises $31M in Series C Funding


Inpria, a Corvallis, Ore.-based developer of high-resolution metal oxide photoresists for extreme ultraviolet lithography (EUV), secured $31m in Series C funding.

The round was led by photoresist manufacturer and existing investor JSR Corporation. New investors included SK hynix Inc. and TSMC Partners. The round also included participation from existing investors Air Liquide Venture Capital ALIAD, Applied Ventures, Intel Capital and Samsung Venture Investment Corporation. In conjunction with the funding, Mark Slezak, President of JSR Micro, joined Inpria’s Board Director.

Led by Andrew Grenville, CEO, Inpria is a metal oxide photoresist design, development and manufacturing company whose EUV photoresists (comprised of tin-oxide nanoclusters) enable semiconductor manufacturers to realize the full potential of EUV lithography. Inpria recently brought online its high-volume manufacturing plant to support the initial production ramp for customers.



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