ThinCI Closes $65M Series C Funding Round

thinciThinCI Inc., an El Dorado Hills, Calif.-based AI hardware startup developing computing platforms for the expanding AI/Machine Learning market, closed its $65M Series C funding round.

The round was led by returning investor DENSO and its subsidiary NSITEXE, Inc., a developer of semiconductor components enabling automated driving, as well as Temasek, GGV Capital, Wavemaker Partners, SG Innovate, and Mirai Creation Fund. In conjunction with the funding, Kheng Nam Lee, Deputy Chairman of Vertex Holdings and Venture Partner at GGV Capital, will join the ThinCI board of directors.

The company will use the funds to continue to expand operations.

Led by CEO Dinakar Munagala, ThinCI is an Artificial Intelligence computing architecture startup. Its Graph Streaming Processor (GSP) and Software Development Kit (SDK) is a general purpose fully programmable computing architecture developed to accelerate and optimize Artificial Intelligence (machine learning, deep learning, neural networks) and Computer Vision workloads in data center servers, edge infrastructure platforms and client platforms in business and consumer applications ranging from massive machine learning farms to sensor fusion and advanced neural networks for autonomous driving.
The company has teams in California, Hyderabad, India and the UK.



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