SBA Materials Closes Series D Financing Round

SBA Materials Inc., a San Jose, CA-based developer of engineered nano-structured dielectrics, closed its Series D financing round of undisclosed amount.

Backers included new investors Air Liquide Venture Capital (ALIAD) and Tokyo Electron Venture Capital and existing investors Intel Capital, Samsung Venture Investment Corporation and Sun Mountain Capital.

The company plans to use the proceeds to continue efforts towards customer qualification and commercialization of its Liquid Phase Self Assembly (LPSA) based ultra low-k dielectric coatings for semiconductor manufacturing, strengthen relationships and partnerships with semiconductor supply chain ecosystem participants, and extend its investigation of new application areas.

Led by Hash Pakbaz, President and CEO, SBA Materials develops nano-porous dielectrics. Its patented Liquid Phase Self Assembly technology enables the design of advanced siloxane-based materials with a broad range of porosities and a combination of electrical, optical and mechanical properties. Applications include high performance logic chip and energy storage markets.



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