SBA Materials Receives Funding from Intel Capital

SBA Materials, an Albuquerque, NM-based developer of nano-porous dielectrics, received funding from Intel Capital.

The amount of the transaction was not disclosed.

Led by Hash Pakbaz, President and CEO, and Mark Phillips, CTO, SBA has developed patented Liquid Phase Self Assembly technology that enables the design of advanced siloxane-based materials with a broad range of porosities and a combination of electrical, optical and mechanical properties.
This class of materials has applications in significant markets ranging from energy storage to high-performance logic chips.
According to the company, its low-k dielectric has the potential to improve the performance of advanced chips used in mobile devices while significantly reducing their power consumption.

FinSMEs

27/10/2013

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