Ranovus, Inc., a Ottawa, Canada and San Jose, USA-based provider of multi-terabit interconnect solutions for Data Center and communications networks, closed an $11m round of financing.
Backers included Azure Capital Partners, T-Venture, BDC Venture Capital, and OMERS Ventures.
The company intends to use the funds to support product delivery and ramp up its interconnect solutions.
Founded in February 2012 and led by Hamid Arabzadeh, Chairman, President and CEO, Ranovus provides solutions for the next generation interconnects for the telecommunications and information technology industries. Its portfolio includes Quantum Dot Multi-Wavelength Laser technology and advanced digital and photonics integrated circuit technologies.