Tessolve Services Completes Series C Venture Financing Round

Tessolve Services, a Bangalore, India-based full-service semiconductor test and product engineering company, has completed its Series C round of venture funding.
The round was led by Reliance Venture Asset Management, venture capital arm of the Reliance ADA Group, with participation from existing investors JAFCO Asia, Qualcomm Ventures and Applied Ventures.
The company, which employes over 400 people, will use the new capital to fund its both organic and inorganic growth.
Tessolve provides engineering capability to support and manage all functions from Design for testability (DFT) through package design, test development, charaterization and optimized production to lower cost throughout the life of the product.
The company is equipped with sophisticated test systems and dedicated engineering team to assist in developing test solutions for RF, advanced mixed-signal, memory and digital devices.

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