Inpria Raises $23.5M in Series B Funding

Inpria, a Corvallis, Ore.-based developer of high-resolution metal oxide photoresists for extreme ultraviolet lithography (EUV), secured $23.5m in Series B funding.

The round was led by existing investor Samsung Ventures, with participation from current investors Aliad (Air Liquide’s venture capital investment arm), Applied Ventures (the venture capital arm of Applied Materials, Inc.), Intel Capital and photoresist supplier JSR Corporation.

The company intends to use the funds to complete pilot manufacturing facility, to commence commercial production, and to grow its workforce.

Led by Andrew Grenville, CEO, Inpria designs metal oxide photoresists for EUV lithography at the 7nm process node and beyond that enable simpler manufacturing flows and larger process windows for an overall reduction in manufacturing cost.



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