Highcon Raises $20M in Funding

Highcon, a Yavne, Israel-based creator of a digital cutting and creasing solution for the post-print market, raised $20m in new funding.

The round was led by Jerusalem Venture Partners (JVP), with participation from existing investors Landa Ventures, LR Group, OurCrowd, and Go Capital.

The company will use the funds for global reach growth and product development of its digital finishing solutions.

Led by Aviv Ratzman, CEO and Co-founder, Highcon transforms traditional print applications such as packages, greeting cards, folders, and large format display items by providing a solution that enables printers and packaging converters to offer differentiated services by introducing automation into the industry. Through its patented Digital Adhesive Rule Technology, the company’s products create crease lines and laser solutions are used for cutting and etching.
Since the launch at drupa 2012, the company has installed more than 50 machines worldwide.



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