Wireless Glue Networks Closes $4.5M Series B Funding

Published On February 22, 2013 |

Wireless Glue Networks, Inc., a Lafayette, CA-based provider of software and hardware solutions that capture and deliver energy data in real-time for the commercial and industrial market, closed a $4.5m Series B round of funding.

Backers included Innovation Network Corporation of Japan, Toko Electric Corporation (Public, TYO: 6921), Hosiden Corporation, and Clean Pacific Ventures.

Led by Peter McCabe, President and CEO, and John Lin, PhD, CTO, Wireless Glue Networks has developed a SmartEdge M2M platform, which allows diverse communication systems and standards to communicate and cross-connect with each other on a single platform.
The company, which has offices in Japan, is currently hiring (read here).

FinSMEs

22/03/2013

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