The capital will be used to start production and customer acquisition for evaluation of a newly developed product based on this technology, and prepare the market entry of SemiLev as a supplier of equipment to the semiconductor industry.
SemiLev Raises Capital from High-Tech Gründerfonds and Bayern Kapital
SemiLev GmbH, a Großwallstadt, Germany-based develops and markets Equipment Frontend Modules (EFEMs) and sorters for wafer-handling in the semiconductor industry, has received an equity financing of undisclosed amount from High-Tech Gründerfonds and Bayern Kapital.
The company has developed a wafer-handling technology that by using only contactless bearings and implementing all energy- and data-transfer wirelessly, aims to consistently avoid contamination (tiny particles that cause defects on the wafer surface), which arises chiefly from wear caused by mechanical bearings and the lubricants they use, by drives and movable cables used in the chip production equipment.
The company was founded in May 2010 by Willi Rugen, Dr. Ulrich Oldendorf, and Mecatronix GmbH.