Advanced Micro-Fabrication Equipment, Inc. (AMEC), a leading Asia-based semiconductor equipment company, closed its Series D financing round by securing $46m from existing investors.
Participants in the round include Shanghai Venture Capital Co. Ltd., Walden International, Lightspeed Venture Partners, Goldman Sachs, Redpoint Ventures, Global Catalyst Partners, InterWest Partners, Bay Partners and Qualcomm Ventures.
Since its inception in 2004, the company has raised more than $150m from venture capital sources.
AMEC develops and manufactures wafer fabrication solutions designed to advance technology, increase productivity and reduce manufacturing costs for leading global semiconductor manufacturers.
As stated by AMEC’s Chairman and CEO, Dr. Gerald Z. Yin, the financing provides extra bandwidth to further position its product (Primo D-RIE(TM), a plasma Etch tool to customers working on very advanced devices) and accelerate volume production”.
The company maintains R&D, manufacturing, business and support operations in China, with sales and support organizations in Japan, Korea, Singapore and Taiwan.